LOCTITE® ABLESTIK ABP 6892
功能與優點
LOCTITE ABLESTIK ABP 6892, Die Attach
LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall improvement in package reliability.
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技術資訊
| 固化類型 | 熱固化 |
| 應用 | 晶片焊接 |
| 熱膨脹係數 (CTE) | 111.4 ppm/°C |
| 熱膨脹係數 (CTE), Above Tg | 190.6 ppm/°C |
| 玻璃化溫度(Tg) | -25.0 °C |
| 粘度，Brookfield, @ 25.0 °C Speed 0.5 rpm | 4100.0 mPa.s (cP) |
| 觸變指數 | 1.75 |
LOCTITE® ABLESTIK ABP 6892
LOCTITE ABLESTIK ABP 6892, Die Attach