LOCTITE® ABLESTIK ABP 6892
特長および利点
LOCTITE ABLESTIK ABP 6892, Die Attach
LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall improvement in package reliability.
詳細はこちら
技術情報
| アプリケーション(用途) | ダイ接着剤 |
| ガラス転移温度 (Tg) | -25.0 °C |
| チクソ性指数 | 1.75 |
| 熱膨張率 | 111.4 ppm/°C |
| 熱膨張率, Above Tg | 190.6 ppm/°C |
| 硬化タイプ | 熱硬化 |
| 粘度、ブルックフィールド, @ 25.0 °C Speed 0.5 rpm | 4100.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 6892
LOCTITE ABLESTIK ABP 6892, Die Attach