LOCTITE® ABLESTIK 8390
다른 명칭: ABLEBOND 8390 (17G)
특징 및 이점
This epoxy-based, thermally and electrically conductive die-attach adhesive is designed for high-throughput applications.
LOCTITE® ABLESTIK 8390 is a silver, thermally and electrically conductive die-attach adhesive for high-throughput applications. It’s compatible with silver-plated and palladium-plated copper lead frames and silver-plated alloy 42 lead frames and as suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in). It demonstrates excellent dispensability with minimal tailing and stringing and minimal resin bleed. It’s formulated with an epoxy-based resin and cures when exposed to heat.
더 보기
기술 정보
| RT 다이 전단 강도, 2 x 2 mm Si die on Ag/Cu leadframe | 11.0 kg-f |
| 경화 방식 | 열경화 |
| 색상 | 은색 |
| 열팽창 계수(CTE) | 60.0 ppm/°C |
| 인장 탄성률, @ 250.0 °C | 517.0 N/mm² (75000.0 psi ) |
| 적용 분야 | 다이 접착 |
| 주요 특성 | 우수한 도포 |
| 추출 가능 이온 함량, 나트륨 이온(Na+) | 9.0 ppm |
| 추출 가능 이온 함량, 염소 이온(CI-) | 19.0 ppm |
| 추출 가능 이온 함량, 칼륨 이온(K+) | 4.0 ppm |
LOCTITE® ABLESTIK 8390
This epoxy-based, thermally and electrically conductive die-attach adhesive is designed for high-throughput applications.