LOCTITE® ABLESTIK 8390
Connu sous le nom de ABLEBOND 8390 (17G)
Caractéristiques et avantages
This epoxy adhesive is specially formulated for use in high throughput die attach applications. It is suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in) with minimal resin bleed.
LOCTITE® ABLESTIK 8390 epoxy die attach adhesive has been specifically formulated for use in high throughput die attach applications, and is suitable for die sizes up to 8 x 8mm (0.31in x 0.31in) with minimal resin bleed. It is thermally conductive, electrically conductive, and is compatible for use with palladium. You can expect excellent dispensability, with minimal tailing and stringing.
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Informations techniques
| Applications | Soudage de puce |
| Caractéristiques clés | Dépose: Dépose bonne |
| Coefficient de dilatation thermique (CDT) | 60.0 ppm/°C |
| Couleur | Argent |
| Module d'élasticité, @ 250.0 °C | 517.0 N/mm² (75000.0 psi ) |
| Résistance au cisaillement puce RT, 2 x 2 mm Si die on Ag/Cu leadframe | 11.0 kg-f |
| Teneur ionique extractible, Chlorure (Cl) | 19.0 ppm |
| Teneur ionique extractible, Potassium (K+) | 4.0 ppm |
| Teneur ionique extractible, Sodium (Na+) | 9.0 ppm |
| Type de polymérisation | Polymérisation par la chaleur |
LOCTITE® ABLESTIK 8390
This epoxy adhesive is specially formulated for use in high throughput die attach applications. It is suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in) with minimal resin bleed.