LOCTITE® ABLESTIK 8390
Conocido como ABLEBOND 8390 (17G)
Características y Ventajas
This epoxy-based, thermally and electrically conductive die-attach adhesive is designed for high-throughput applications.
LOCTITE® ABLESTIK 8390 is a silver, thermally and electrically conductive die-attach adhesive for high-throughput applications. It’s compatible with silver-plated and palladium-plated copper lead frames and silver-plated alloy 42 lead frames and as suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in). It demonstrates excellent dispensability with minimal tailing and stringing and minimal resin bleed. It’s formulated with an epoxy-based resin and cures when exposed to heat.
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Información técnica
| Aplicaciones | Unión |
| Características Principales | Capacidad de Dosificación: Buena Dosificación |
| Coeficiente de dilatación térmica (CDT) | 60.0 ppm/°C |
| Color | Plata |
| Contenido iónico extraíble, Cloruro (CI-) | 19.0 ppm |
| Contenido iónico extraíble, Potasio (K+) | 4.0 ppm |
| Contenido iónico extraíble, Sodio (Na+) | 9.0 ppm |
| Módulo de tracción, @ 250.0 °C | 517.0 N/mm² (75000.0 psi ) |
| Resistencia al corte a temperatura ambiente, 2 x 2 mm Si die on Ag/Cu leadframe | 11.0 kg-f |
| Tipo de curado | Curado Térmico |
LOCTITE® ABLESTIK 8390
This epoxy-based, thermally and electrically conductive die-attach adhesive is designed for high-throughput applications.