LOCTITE® ABLESTIK 8390

Known as ABLEBOND 8390 (17G)

Features and Benefits

This epoxy adhesive is specially formulated for use in high throughput die attach applications. It is suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in) with minimal resin bleed.
LOCTITE® ABLESTIK 8390 epoxy die attach adhesive has been specifically formulated for use in high throughput die attach applications, and is suitable for die sizes up to 8 x 8mm (0.31in x 0.31in) with minimal resin bleed. It is thermally conductive, electrically conductive, and is compatible for use with palladium. You can expect excellent dispensability, with minimal tailing and stringing.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 60.0 ppm/°C
Colour Silver
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 19.0 ppm
Extractable ionic content, Potassium (K+) 4.0 ppm
Extractable ionic content, Sodium (Na+) 9.0 ppm
Key characteristics Dispensibility: good dispensibility
RT die shear strength, 2 x 2 mm Si die on Ag/Cu leadframe 11.0 kg-f
Tensile modulus, @ 250.0 °C 517.0 N/mm² (75000.0 psi )