LOCTITE® ABLESTIK 8390
Tuntud kui ABLEBOND 8390 (17G)
Omadused ja eelised
This epoxy adhesive is specially formulated for use in high throughput die attach applications. It is suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in) with minimal resin bleed.
LOCTITE® ABLESTIK 8390 epoxy die attach adhesive has been specifically formulated for use in high throughput die attach applications, and is suitable for die sizes up to 8 x 8mm (0.31in x 0.31in) with minimal resin bleed. It is thermally conductive, electrically conductive, and is compatible for use with palladium. You can expect excellent dispensability, with minimal tailing and stringing.
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Tehniline teave
Ekstraheeritav ioonisisu, Kaalium (K+) | 4.0 ppm |
Ekstraheeritav ioonisisu, Kloriid (CI-) | 19.0 ppm |
Ekstraheeritav ioonisisu, Naatrium (Na+) | 9.0 ppm |
Peamised omadused | Pihustatavus: Hea |
RT kuumlõike nihkejõud, 2 x 2 mm Si die on Ag/Cu leadframe | 11.0 kg-f |
Rakendused | Stantskinnitus |
Soojuspaisumise koefitsient (CTE) | 60.0 ppm/°C |
Tahkumistüüp | Kuumkõvenemine |
Tõmbemoodul, @ 250.0 °C | 517.0 N/mm² (75000.0 psi ) |
Värvus | Hõbedane |