LOCTITE® ABLESTIK 8390
Known as ABLEBOND 8390 (17G)
Features and Benefits
This epoxy adhesive is specially formulated for use in high throughput die attach applications. It is suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in) with minimal resin bleed.
LOCTITE® ABLESTIK 8390 epoxy die attach adhesive has been specifically formulated for use in high throughput die attach applications, and is suitable for die sizes up to 8 x 8mm (0.31in x 0.31in) with minimal resin bleed. It is thermally conductive, electrically conductive, and is compatible for use with palladium. You can expect excellent dispensability, with minimal tailing and stringing.
- Minimal resin bleed
- Thermally conductive
- Electrically conductive
- In-line oven snap cure
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 60.0 ppm/°C |
| Color | Silver |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 19.0 ppm |
| Extractable ionic content, Potassium (K+) | 4.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Key characteristics | Dispensibility: good dispensibility |
| RT die shear strength, 2 x 2 mm Si die on Ag/Cu leadframe | 11.0 kg-f |
| Tensile modulus, @ 250.0 °C | 517.0 N/mm² (75000.0 psi ) |
LOCTITE® ABLESTIK 8390
This epoxy adhesive is specially formulated for use in high throughput die attach applications. It is suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in) with minimal resin bleed.