LOCTITE® ABLESTIK 8390
旧名称 ABLEBOND 8390 (17G)
特長および利点
This epoxy adhesive is specially formulated for use in high throughput die attach applications. It is suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in) with minimal resin bleed.
LOCTITE® ABLESTIK 8390 epoxy die attach adhesive has been specifically formulated for use in high throughput die attach applications, and is suitable for die sizes up to 8 x 8mm (0.31in x 0.31in) with minimal resin bleed. It is thermally conductive, electrically conductive, and is compatible for use with palladium. You can expect excellent dispensability, with minimal tailing and stringing.
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技術情報
| RTダイせん断強度, 2 x 2 mm Si die on Ag/Cu leadframe | 11.0 kg-f |
| アプリケーション(用途) | ダイ接着剤 |
| 主成分 | 塗布性: 良好 |
| 引張係数, @ 250.0 °C | 517.0 N/mm² (75000.0 psi ) |
| 抽出可能なイオン含有量, カリウム(K+) | 4.0 ppm |
| 抽出可能なイオン含有量, ナトリウム(Na+) | 9.0 ppm |
| 抽出可能なイオン含有量, 塩化物 (CI-) | 19.0 ppm |
| 熱膨張率 | 60.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
| 色 | シルバー（銀) |
LOCTITE® ABLESTIK 8390
This epoxy adhesive is specially formulated for use in high throughput die attach applications. It is suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in) with minimal resin bleed.