LOCTITE® ABLESTIK 8390
旧名称 ABLEBOND 8390 (17G)
特長および利点
This epoxy-based, thermally and electrically conductive die-attach adhesive is designed for high-throughput applications.
LOCTITE® ABLESTIK 8390 is a silver, thermally and electrically conductive die-attach adhesive for high-throughput applications. It’s compatible with silver-plated and palladium-plated copper lead frames and silver-plated alloy 42 lead frames and as suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in). It demonstrates excellent dispensability with minimal tailing and stringing and minimal resin bleed. It’s formulated with an epoxy-based resin and cures when exposed to heat.
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技術情報
| RTダイせん断強度, 2 x 2 mm Si die on Ag/Cu leadframe | 11.0 kg-f |
| アプリケーション(用途) | ダイ接着剤 |
| 主成分 | 塗布性: 良好 |
| 引張係数, @ 250.0 °C | 517.0 N/mm² (75000.0 psi ) |
| 抽出可能なイオン含有量, カリウム(K+) | 4.0 ppm |
| 抽出可能なイオン含有量, ナトリウム(Na+) | 9.0 ppm |
| 抽出可能なイオン含有量, 塩化物 (CI-) | 19.0 ppm |
| 熱膨張率 | 60.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
| 色 | シルバー（銀) |
LOCTITE® ABLESTIK 8390
This epoxy-based, thermally and electrically conductive die-attach adhesive is designed for high-throughput applications.