LOCTITE® ABLESTIK 8390
Features and Benefits
This epoxy-based, thermally and electrically conductive die-attach adhesive is designed for high-throughput applications.
LOCTITE® ABLESTIK 8390 is a silver, thermally and electrically conductive die-attach adhesive for high-throughput applications. It’s compatible with silver-plated and palladium-plated copper lead frames and silver-plated alloy 42 lead frames and as suitable for die sizes up to 8mm x 8mm (0.31in x 0.31in). It demonstrates excellent dispensability with minimal tailing and stringing and minimal resin bleed. It’s formulated with an epoxy-based resin and cures when exposed to heat.
- Suitable for die sizes up to 8x8mm
- Compatible with palladium
- Offers excellent dispensability
- In-line oven snap cure
- Low condensable volatiles
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 60.0 ppm/°C |
| Colour | Silver |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 19.0 ppm |
| Extractable ionic content, Potassium (K+) | 4.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Key characteristics | Dispensibility: good dispensibility |
| RT die shear strength, 2 x 2 mm Si die on Ag/Cu leadframe | 11.0 kg-f |
| Tensile modulus, @ 250.0 °C | 517.0 N/mm² (75000.0 psi ) |
LOCTITE® ABLESTIK 8390
This epoxy-based, thermally and electrically conductive die-attach adhesive is designed for high-throughput applications.