LOCTITE® ABLESTIK 6202C
功能与优点
LOCTITE ABLESTIK 6202C, Proprietary Hybrid Chemistry, Low Modulus, Die Attach Adhesive
LOCTITE® ABLESTIK 6202C B-stageable adhesive is ideal for chip scale packages where tolerance and bleed need to be minimized. This low modulus adhesive is recommended for large die sizes.
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技术信息
| RT 模剪切强度 | 10.4 kg-f |
| 可萃取出的离子含量, 氯化物 (CI-) | 24.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 19.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 19.0 ppm |
| 固化方式 | 热+紫外线 |
| 密度, Maximum Final | 1.1 g/cm³ |
| 应用 | 芯片焊接 |
| 拉伸模量, @ 250.0 °C | 6.0 N/mm² (812.0 psi ) |
| 热模剪切强度 | 1.1 kg-f |
| 热膨胀系数 (CTE) | 70.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 350.0 ppm/°C |
| 玻璃化温度 (Tg) | 40.0 °C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 28000.0 mPa.s (cP) |
| 触变指数 | 2.3 |
LOCTITE® ABLESTIK 6202C
LOCTITE ABLESTIK 6202C, Proprietary Hybrid Chemistry, Low Modulus, Die Attach Adhesive