LOCTITE® ABLESTIK 6202C
Features and Benefits
LOCTITE ABLESTIK 6202C, Proprietary Hybrid Chemistry, Low Modulus, Die Attach Adhesive
LOCTITE® ABLESTIK 6202C B-stageable adhesive is ideal for chip scale packages where tolerance and bleed need to be minimized. This low modulus adhesive is recommended for large die sizes.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 70.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 350.0 ppm/°C |
| Cure type | Heat cure |
| Density, Maximum Final | 1.1 g/cm³ |
| Extractable ionic content, Chloride (CI-) | 24.0 ppm |
| Extractable ionic content, Potassium (K+) | 19.0 ppm |
| Extractable ionic content, Sodium (Na+) | 19.0 ppm |
| Glass transition temperature (Tg) | 40.0 °C |
| Hot die shear strength | 1.1 kg-f |
| RT die shear strength | 10.4 kg-f |
| Tensile modulus, @ 250.0 °C | 6.0 N/mm² (812.0 psi ) |
| Thixotropic index | 2.3 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 28000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 6202C
LOCTITE ABLESTIK 6202C, Proprietary Hybrid Chemistry, Low Modulus, Die Attach Adhesive