LOCTITE® ABLESTIK 2053S
被称为 ABLEBOND 2053S (10G)
功能与优点
A red non-conductive die-attach adhesive for flex, laminate and die-to-die.
A LOCTITE® ABLESTIK 2053S is a polymer-filled, hybrid, non-conductive die-attach adhesive for array packaging. It's typically used for the ASIC (Application Specific Integrated Circuit) attach of automotive optical sensors, as a receiver and die-attach for 3D sensing modules. It's proven effective on various substrates, such as EMC, engineering plastic, glass and metals, and offers low warpage, stress and moisture uptake. LOCTITE ABLESTIK 2053S is a low-modulus adhesive, making it ideal for wire bonding small die sizes and chip bonding on FR4 substrates. It cures when exposed to heat.
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技术信息
| RT 模剪切强度 | 6.0 kg-f |
| 可萃取出的离子含量, 氯化物 (CI-) | 9.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 9.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 9.0 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 拉伸模量, @ 250.0 °C | 22.0 N/mm² (3200.0 psi ) |
| 热模剪切强度 | 2.1 kg-f |
| 热膨胀系数 (CTE) | 149.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 216.0 ppm/°C |
| 玻璃化温度 (Tg) | -21.0 °C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 130000.0 mPa.s (cP) |
| 触变指数 | 2.5 |
LOCTITE® ABLESTIK 2053S
A red non-conductive die-attach adhesive for flex, laminate and die-to-die.