LOCTITE® ABLESTIK 2053S
U svojstvu ABLEBOND 2053S (10G)
Značajke i prednosti
A red non-conductive die-attach adhesive for flex, laminate and die-to-die.
A LOCTITE® ABLESTIK 2053S is a polymer-filled, hybrid, non-conductive die-attach adhesive for array packaging. It's typically used for the ASIC (Application Specific Integrated Circuit) attach of automotive optical sensors, as a receiver and die-attach for 3D sensing modules. It's proven effective on various substrates, such as EMC, engineering plastic, glass and metals, and offers low warpage, stress and moisture uptake. LOCTITE ABLESTIK 2053S is a low-modulus adhesive, making it ideal for wire bonding small die sizes and chip bonding on FR4 substrates. It cures when exposed to heat.
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Dokumenti i preuzimanja
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Tehnički podaci
| Izvlačivi jonski sadržaj, Kalij (K+) | 9.0 ppm |
| Izvlačivi jonski sadržaj, Klorid (CI-) | 9.0 ppm |
| Izvlačivi jonski sadržaj, Natrij (Na+) | 9.0 ppm |
| Koeficijent toplinske ekspanzije (CTE) | 149.0 ppm/°C |
| Koeficijent toplinske ekspanzije (CTE), Above Tg | 216.0 ppm/°C |
| Primjene | Ukalupljeno |
| Snaga smicanja u kalupu RT | 6.0 kg-f |
| Snaga smicanja u vrućem kalupu | 2.1 kg-f |
| Temperatura prelaska u staklo (Tg) | -21.0 °C |
| Tiksotropni indeks | 2.5 |
| Tip stvrdnjavanja | Toplinsko stvrdnjavanje |
| Viskoznost, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 130000.0 mPa.s (cP) |
| Vlačni modul, @ 250.0 °C | 22.0 N/mm² (3200.0 psi ) |
LOCTITE® ABLESTIK 2053S
A red non-conductive die-attach adhesive for flex, laminate and die-to-die.