LOCTITE® ABLESTIK 2053S
Connu sous le nom de ABLEBOND 2053S (10G)
Caractéristiques et avantages
A red non-conductive die-attach adhesive for flex, laminate and die-to-die.
A LOCTITE® ABLESTIK 2053S is a polymer-filled, hybrid, non-conductive die-attach adhesive for array packaging. It's typically used for the ASIC (Application Specific Integrated Circuit) attach of automotive optical sensors, as a receiver and die-attach for 3D sensing modules. It's proven effective on various substrates, such as EMC, engineering plastic, glass and metals, and offers low warpage, stress and moisture uptake. LOCTITE ABLESTIK 2053S is a low-modulus adhesive, making it ideal for wire bonding small die sizes and chip bonding on FR4 substrates. It cures when exposed to heat.
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Informations techniques
| Applications | Soudage de puce |
| Coefficient de dilatation thermique (CDT) | 149.0 ppm/°C |
| Coefficient de dilatation thermique (CDT), Above Tg | 216.0 ppm/°C |
| Indice thixotropique | 2.5 |
| Module d'élasticité, @ 250.0 °C | 22.0 N/mm² (3200.0 psi ) |
| Résistance au cisaillement puce RT | 6.0 kg-f |
| Résistance au cisaillement puce chaude | 2.1 kg-f |
| Température de transition vitreuse | -21.0 °C |
| Teneur ionique extractible, Chlorure (Cl) | 9.0 ppm |
| Teneur ionique extractible, Potassium (K+) | 9.0 ppm |
| Teneur ionique extractible, Sodium (Na+) | 9.0 ppm |
| Type de polymérisation | Polymérisation par la chaleur |
| Viscosité, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 130000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 2053S
A red non-conductive die-attach adhesive for flex, laminate and die-to-die.