LOCTITE® ABLESTIK 2053S
Conocido como ABLEBOND 2053S (10G)
Características y Ventajas
A red non-conductive die-attach adhesive for flex, laminate and die-to-die.
A LOCTITE® ABLESTIK 2053S is a polymer-filled, hybrid, non-conductive die-attach adhesive for array packaging. It's typically used for the ASIC (Application Specific Integrated Circuit) attach of automotive optical sensors, as a receiver and die-attach for 3D sensing modules. It's proven effective on various substrates, such as EMC, engineering plastic, glass and metals, and offers low warpage, stress and moisture uptake. LOCTITE ABLESTIK 2053S is a low-modulus adhesive, making it ideal for wire bonding small die sizes and chip bonding on FR4 substrates. It cures when exposed to heat.
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Información técnica
| Aplicaciones | Unión |
| Coeficiente de dilatación térmica (CDT) | 149.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Above Tg | 216.0 ppm/°C |
| Contenido iónico extraíble, Cloruro (CI-) | 9.0 ppm |
| Contenido iónico extraíble, Potasio (K+) | 9.0 ppm |
| Contenido iónico extraíble, Sodio (Na+) | 9.0 ppm |
| Módulo de tracción, @ 250.0 °C | 22.0 N/mm² (3200.0 psi ) |
| Resistencia al corte a temperatura ambiente | 6.0 kg-f |
| Resistencia al corte con calor | 2.1 kg-f |
| Temperatura de transición vítrea (Tg) | -21.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 130000.0 mPa.s (cP) |
| Índice tixotrópico | 2.5 |
LOCTITE® ABLESTIK 2053S
A red non-conductive die-attach adhesive for flex, laminate and die-to-die.