LOCTITE® ABLESTIK 2053S

Poznat kao ABLEBOND 2053S (10G)

Elementi i pogodnosti

A red non-conductive die-attach adhesive for flex, laminate and die-to-die.
A LOCTITE® ABLESTIK 2053S is a polymer-filled, hybrid, non-conductive die-attach adhesive for array packaging. It's typically used for the ASIC (Application Specific Integrated Circuit) attach of automotive optical sensors, as a receiver and die-attach for 3D sensing modules. It's proven effective on various substrates, such as EMC, engineering plastic, glass and metals, and offers low warpage, stress and moisture uptake. LOCTITE ABLESTIK 2053S is a low-modulus adhesive, making it ideal for wire bonding small die sizes and chip bonding on FR4 substrates. It cures when exposed to heat.
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Dokumenti i preuzimanja

Tehnički podaci

Jonski sadržaj koji se izvlači, Hlorid (Cl-) 9.0 ppm
Jonski sadržaj koji se izvlači, Kalijum (K+) 9.0 ppm
Jonski sadržaj koji se izvlači, Natrijum (Na+) 9.0 ppm
Koeficijent toplotnog širenja (CTE) 149.0 ppm/°C
Koeficijent toplotnog širenja (CTE), Above Tg 216.0 ppm/°C
Modul elastičnosti, @ 250.0 °C 22.0 N/mm² (3200.0 psi )
Primene Dodavanje boje
Sila smicanja RT kalupa 6.0 kg-f
Sila smicanja vrućeg kalupa 2.1 kg-f
Temperatura razmekšavanja (Tg) -21.0 °C
Tiksotropni indeks 2.5
Tip očvršćavanja Očvršćavanje pomoću zagrevanja
Viskoznost, Brookfield CP51, @ 25.0 °C Speed 5 rpm 130000.0 mPa.s (cP)