LOCTITE® ABLESTIK 8006NS
Features and Benefits
LOCTITE ABLESTIK 8006NS, Epoxy, Non-conductive, Die Attach Adhesive
LOCTITE® ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed for application by stencil or screen printing. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. Once B-staged, this adhesive remains stable and can be placed into storage for several months. With proper die bonder setup along with incorporating adequate die placement pressure, a consistent minimum bondline thickness of 1mil can be achieved with minimal die tilt.
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Technical Information
| Application method | Dispense system |
| Applications | Die attach |
| Color | White |
| Cure schedule, @ 160.0 °C | 2.0 hr. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 14.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Filler type | Alumina/Silica |
| Key characteristics | Conductivity: electrically non-conductive, Printable, Screen printable |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength, 2 x 2 mm Si die on ceramic | 13.0 kg-f |
| Tensile modulus, @ 150.0 °C | 1196.0 N/mm² (176400.0 psi ) |
| Thermal conductivity | 0.44 W/mK |
| Thixotropic index | 1.3 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 55000.0 mPa·s (cP) |
| Volume resistivity | 0.43x10¹⁴ Ohm cm |
LOCTITE® ABLESTIK 8006NS
LOCTITE ABLESTIK 8006NS, Epoxy, Non-conductive, Die Attach Adhesive