LOCTITE® ABLESTIK ABP 2036SF
功能与优点
LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.
LOCTITE® ABLESTIK ABP 2036SF has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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技术信息
| RT 模剪切强度, 2 x 2 mm Si die on PPF leadframe | 12.0 kg-f |
| 主要特性 | 传导性：不导电, 固化速度：快速固化, 应力：应力 |
| 固化方式 | 热+紫外线 |
| 填料类型 | 二氧化硅 |
| 外观形态 | 膏状 |
| 导热性 | 0.35 W/mK |
| 应用 | 芯片焊接 |
| 应用方法 | 加药装置 |
| 拉伸模量, @ 250.0 °C | 55.0 N/mm² (8180.0 psi ) |
| 推荐与以下物料搭配使用 | 引线框：金 |
| 热模剪切强度, @ 150.0 °C 2 x 2 mm Si die on PPF leadframe | 1.6 kg-f |
| 玻璃化温度 (Tg) | 125.0 °C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 12760.0 mPa.s (cP) |
| 组分数量 | 单组份 |
| 触变指数 | 4.42 |
| 颜色 | 红 |
LOCTITE® ABLESTIK ABP 2036SF
LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.