LOCTITE® ABLESTIK ABP 2036SF

Features and Benefits

LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.
LOCTITE® ABLESTIK ABP 2036SF has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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Technical Information

Application method Dispense system
Applications Die attach
Colour Red
Cure type Heat cure
Filler type Silica
Glass transition temperature (Tg) 125.0 °C
Hot die shear strength, @ 150.0 °C 2 x 2 mm Si die on PPF leadframe 1.6 kg-f
Key characteristics Conductivity: electrically non-conductive, Cure speed: fast cure, Stress: low stress
Number of components 1 part
Physical form Paste
RT die shear strength, 2 x 2 mm Si die on PPF leadframe 12.0 kg-f
Recommended for use with LeadFrame: gold
Tensile modulus, @ 250.0 °C 55.0 N/mm² (8180.0 psi )
Thermal conductivity 0.35 W/mK
Thixotropic index 4.42
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 12760.0 mPa·s (cP)