LOCTITE® ABLESTIK ABP 2036SF
Features and Benefits
LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.
LOCTITE® ABLESTIK ABP 2036SF has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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Technical Information
| Application method | Dispense system |
| Applications | Die attach |
| Colour | Red |
| Cure type | Heat cure |
| Filler type | Silica |
| Glass transition temperature (Tg) | 125.0 °C |
| Hot die shear strength, @ 150.0 °C 2 x 2 mm Si die on PPF leadframe | 1.6 kg-f |
| Key characteristics | Conductivity: electrically non-conductive, Cure speed: fast cure, Stress: low stress |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength, 2 x 2 mm Si die on PPF leadframe | 12.0 kg-f |
| Recommended for use with | LeadFrame: gold |
| Tensile modulus, @ 250.0 °C | 55.0 N/mm² (8180.0 psi ) |
| Thermal conductivity | 0.35 W/mK |
| Thixotropic index | 4.42 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 12760.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 2036SF
LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.