LOCTITE® ABLESTIK QMI519
Lastnosti in prednosti
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.
LOCTITE® ABLESTIK QMI519 is a single component, hydrophobic, silver filled conductive that is stable at high temperatures and provides good resistance to “popcorning” when exposed to reflow temperatures. This product also provides high resistance to delamination and is designed to achieve higher UPHs than conventional oven cured adhesives.
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Tehnične informacije
| Izvlečna ionska vsebina, Fluorid (F-) | 20.0 ppm |
| Izvlečna ionska vsebina, Kalij (K+) | 20.0 ppm |
| Izvlečna ionska vsebina, Klorid (CI-) | 20.0 ppm |
| Izvlečna ionska vsebina, Natrij (Na+) | 20.0 ppm |
| Koeficient toplotnega raztezanja (CTE) | 40.0 ppm/°C |
| Način strjevanja | Strjevanje na podlagi toplote |
| Primeri uporabe | Pritrjevalniki |
| Strižna trdnost RT | 59.0 kg-f |
| Youngovi moduli, @ 25.0 °C | 5300.0 N/mm² (769000.0 psi ) |
LOCTITE® ABLESTIK QMI519
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.