LOCTITE® ABLESTIK QMI519
Merkmale und Vorteile
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.
LOCTITE® ABLESTIK QMI519 is a single component, hydrophobic, silver filled conductive that is stable at high temperatures and provides good resistance to “popcorning” when exposed to reflow temperatures. This product also provides high resistance to delamination and is designed to achieve higher UPHs than conventional oven cured adhesives.
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Technische Informationen
| Anwendungen | Gesenk-Verbindung |
| Aushärtetechnik | Aushärtung durch Wärme |
| Elastizitätsmodul, @ 25.0 °C | 5300.0 N/mm² (769000.0 psi ) |
| Extrahierbarer Ionengehalt, Chlorid (CI-) | 20.0 ppm |
| Extrahierbarer Ionengehalt, Fluorid (F-) | 20.0 ppm |
| Extrahierbarer Ionengehalt, Kalium (K+) | 20.0 ppm |
| Extrahierbarer Ionengehalt, Natrium (Na+) | 20.0 ppm |
| RT Scherfestigkeit der Matrize | 59.0 kg-f |
| Wärmeausdehnungskoeffizient (CTE) | 40.0 ppm/°C |
LOCTITE® ABLESTIK QMI519
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.