LOCTITE® ABLESTIK QMI519
Caratteristiche e vantaggi
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.
LOCTITE® ABLESTIK QMI519 is a single component, hydrophobic, silver filled conductive that is stable at high temperatures and provides good resistance to “popcorning” when exposed to reflow temperatures. This product also provides high resistance to delamination and is designed to achieve higher UPHs than conventional oven cured adhesives.
Leggi tutto
Documenti e download
Cerchi una TDS o un SDS in un'altra lingua?
Documenti aggiuntivi
Informazioni tecniche
| Applicazioni | Die attach |
| Coefficiente di espansione termica (CTE) | 40.0 ppm/°C |
| Contenuto ionico estraibile, Cloruro (CI-) | 20.0 ppm |
| Contenuto ionico estraibile, Fluoruro (F-) | 20.0 ppm |
| Contenuto ionico estraibile, Potassio (K+) | 20.0 ppm |
| Contenuto ionico estraibile, Sodio (Na+) | 20.0 ppm |
| Modulo di Young, @ 25.0 °C | 5300.0 N/mm² (769000.0 psi ) |
| Resistenza al taglio matrice temperatura ambiente | 59.0 kg-f |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
LOCTITE® ABLESTIK QMI519
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.