LOCTITE® ABLESTIK QMI519
Características y Ventajas
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.
LOCTITE® ABLESTIK QMI519 is a single component, hydrophobic, silver filled conductive that is stable at high temperatures and provides good resistance to “popcorning” when exposed to reflow temperatures. This product also provides high resistance to delamination and is designed to achieve higher UPHs than conventional oven cured adhesives.
Leer más
Documentos y Descargas
¿Está buscando un TDS o SDS en otro idioma?
Documentos adicionales
Información técnica
| Aplicaciones | Unión |
| Coeficiente de dilatación térmica (CDT) | 40.0 ppm/°C |
| Contenido iónico extraíble, Cloruro (CI-) | 20.0 ppm |
| Contenido iónico extraíble, Fluoruro (F-) | 20.0 ppm |
| Contenido iónico extraíble, Potasio (K+) | 20.0 ppm |
| Contenido iónico extraíble, Sodio (Na+) | 20.0 ppm |
| Módulo de Young, @ 25.0 °C | 5300.0 N/mm² (769000.0 psi ) |
| Resistencia al corte a temperatura ambiente | 59.0 kg-f |
| Tipo de curado | Curado Térmico |
LOCTITE® ABLESTIK QMI519
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.