LOCTITE® ABLESTIK QMI519
Caractéristiques et avantages
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.
LOCTITE® ABLESTIK QMI519 is a single component, hydrophobic, silver filled conductive that is stable at high temperatures and provides good resistance to “popcorning” when exposed to reflow temperatures. This product also provides high resistance to delamination and is designed to achieve higher UPHs than conventional oven cured adhesives.
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Informations techniques
| Applications | Soudage de puce |
| Coefficient de dilatation thermique (CDT) | 40.0 ppm/°C |
| Module de Young, @ 25.0 °C | 5300.0 N/mm² (769000.0 psi ) |
| Résistance au cisaillement puce RT | 59.0 kg-f |
| Teneur ionique extractible, Chlorure (Cl) | 20.0 ppm |
| Teneur ionique extractible, Fluorure (F) | 20.0 ppm |
| Teneur ionique extractible, Potassium (K+) | 20.0 ppm |
| Teneur ionique extractible, Sodium (Na+) | 20.0 ppm |
| Type de polymérisation | Polymérisation par la chaleur |
LOCTITE® ABLESTIK QMI519
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.