LOCTITE® ABLESTIK QMI519
Elementi i pogodnosti
This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.
LOCTITE® ABLESTIK QMI519 is a silver, thermally and electrically conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It’s typically used for QFN, SOIC and SO package applications and is compatible with a wide variety of metals and ceramic surfaces, copper, silver, palladium and alloy 42. It’s designed to achieve higher UPHs than conventional oven cured adhesives. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater. Studies have also shown that parts cured on the die bonder have improved coplanarity. LOCTITE ABLESTIK QMI519 is formulated with a BMI acrylate-based resin and cures when exposed to heat.
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Tehnički podaci
Jangov modul, @ 25.0 °C | 5300.0 N/mm² (769000.0 psi ) |
Jonski sadržaj koji se izvlači, Fluorid (F-) | 20.0 ppm |
Jonski sadržaj koji se izvlači, Hlorid (Cl-) | 20.0 ppm |
Jonski sadržaj koji se izvlači, Kalijum (K+) | 20.0 ppm |
Jonski sadržaj koji se izvlači, Natrijum (Na+) | 20.0 ppm |
Koeficijent toplotnog širenja (CTE) | 40.0 ppm/°C |
Primene | Dodavanje boje |
Sila smicanja RT kalupa | 59.0 kg-f |
Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |