LOCTITE® ABLESTIK 2025D
Known as ABLEBOND 2025D (14G)
Features and Benefits
A red non-conductive die-attach adhesive for PBGA, FlexBGA and Stacking BGA.
LOCTITE® ABLESTIK 2025D is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for array packaging. It exhibits minimal resin bleed-out (RBO) and is typically used in PBGA, FlexBGA, and Stacking BGA package applications. LOCTITE ABLESTIK 2025D cures when exposed to heat to form a strong material with excellent hot/wet die shear strength and good adhesion to many different substrates.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 48.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 140.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 3.5 kg-f |
| RT die shear strength | 20.0 kg-f |
| Tensile modulus, @ 250.0 °C | 116.0 N/mm² (16800.0 psi ) |
| Thermal conductivity | 0.4 W/mK |
| Thixotropic index | 4.4 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa·s (cP) |
LOCTITE® ABLESTIK 2025D
A red non-conductive die-attach adhesive for PBGA, FlexBGA and Stacking BGA.