LOCTITE® ABLESTIK 2025D
旧名称 ABLEBOND 2025D (14G)
特長および利点
A red non-conductive die-attach adhesive for PBGA, FlexBGA and Stacking BGA.
LOCTITE® ABLESTIK 2025D is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for array packaging. It exhibits minimal resin bleed-out (RBO) and is typically used in PBGA, FlexBGA, and Stacking BGA package applications. LOCTITE ABLESTIK 2025D cures when exposed to heat to form a strong material with excellent hot/wet die shear strength and good adhesion to many different substrates.
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技術情報
| RTダイせん断強度 | 20.0 kg-f |
| アプリケーション(用途) | ダイ接着剤 |
| チクソ性指数 | 4.4 |
| ホットダイせん断強さ | 3.5 kg-f |
| 引張係数, @ 250.0 °C | 116.0 N/mm² (16800.0 psi ) |
| 抽出可能なイオン含有量, カリウム(K+) | 9.0 ppm |
| 抽出可能なイオン含有量, ナトリウム(Na+) | 9.0 ppm |
| 抽出可能なイオン含有量, 塩化物 (CI-) | 9.0 ppm |
| 熱伝導率 | 0.4 W/mK |
| 熱膨張率 | 48.0 ppm/°C |
| 熱膨張率, Above Tg | 140.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
| 粘度、ブルックフィールド CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa.s (cP) |
LOCTITE® ABLESTIK 2025D
A red non-conductive die-attach adhesive for PBGA, FlexBGA and Stacking BGA.