LOCTITE® ABLESTIK ABP 84-3JT

功能与优点

LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach
LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material suitable for use on copper wire bonding applications where die shift issues during processing should be avoided. It contains 1 mil spacers for better bondline and stress control.
了解更多

技术信息

固化方式 热+紫外线
导热性 0.6 W/mK
应用 芯片焊接
热膨胀系数 (CTE) 36.0 ppm/°C
热膨胀系数 (CTE), Above Tg 117.0 ppm/°C
玻璃化温度 (Tg) 56.0 °C
粘度,博勒菲, @ 25.0 °C Speed 5 rpm 10900.0 mPa.s (cP)
触变指数 4.4