LOCTITE® ABLESTIK ABP 84-3JT
功能与优点
LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach
LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material suitable for use on copper wire bonding applications where die shift issues during processing should be avoided. It contains 1 mil spacers for better bondline and stress control.
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技术信息
固化方式 | 热+紫外线 |
导热性 | 0.6 W/mK |
应用 | 芯片焊接 |
热膨胀系数 (CTE) | 36.0 ppm/°C |
热膨胀系数 (CTE), Above Tg | 117.0 ppm/°C |
玻璃化温度 (Tg) | 56.0 °C |
粘度,博勒菲, @ 25.0 °C Speed 5 rpm | 10900.0 mPa.s (cP) |
触变指数 | 4.4 |