LOCTITE® ABLESTIK ABP 84-3JT
Features and Benefits
LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach
LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material suitable for use on copper wire bonding applications where die shift issues during processing should be avoided. It contains 1 mil spacers for better bondline and stress control.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 36.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 117.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 56.0 °C |
| Thermal conductivity | 0.6 W/mK |
| Thixotropic index | 4.4 |
| Viscosity, Brookfield, @ 25.0 °C Speed 5 rpm | 10900.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 84-3JT
LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach