LOCTITE® ABLESTIK ABP 84-3JT

Omadused ja eelised

LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach
LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material suitable for use on copper wire bonding applications where die shift issues during processing should be avoided. It contains 1 mil spacers for better bondline and stress control.
Lugege rohkem

Tehniline teave

Klaasistumistemperatuur (Tg) 56.0 °C
Rakendused Stantskinnitus
Soojusjuhtivus 0.6 W/mK
Soojuspaisumise koefitsient (CTE) 36.0 ppm/°C
Soojuspaisumise koefitsient (CTE), Above Tg 117.0 ppm/°C
Tahkumistüüp Kuumkõvenemine
Tiksotroopne indeks 4.4
Viskoossus, Brookfield, @ 25.0 °C Speed 5 rpm 10900.0 mPa.s (cP)