LOCTITE® ABLESTIK ABP 84-3JT

Elementi i pogodnosti

LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach
LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material suitable for use on copper wire bonding applications where die shift issues during processing should be avoided. It contains 1 mil spacers for better bondline and stress control.
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Dokumenti i preuzimanja

Tehnički podaci

Koeficijent toplotnog širenja (CTE) 36.0 ppm/°C
Koeficijent toplotnog širenja (CTE), Above Tg 117.0 ppm/°C
Primene Dodavanje boje
Temperatura razmekšavanja (Tg) 56.0 °C
Tiksotropni indeks 4.4
Tip očvršćavanja Očvršćavanje pomoću zagrevanja
Toplotna provodljivost 0.6 W/mK
Viskoznost, Brookfield, @ 25.0 °C Speed 5 rpm 10900.0 mPa.s (cP)