LOCTITE® ABLESTIK ABP 84-3JT

Caractéristiques et avantages

LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach
LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material suitable for use on copper wire bonding applications where die shift issues during processing should be avoided. It contains 1 mil spacers for better bondline and stress control.
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Informations techniques

Applications Soudage de puce
Coefficient de dilatation thermique (CDT) 36.0 ppm/°C
Coefficient de dilatation thermique (CDT), Above Tg 117.0 ppm/°C
Conductivité thermique 0.6 W/mK
Indice thixotropique 4.4
Température de transition vitreuse 56.0 °C
Type de polymérisation Polymérisation par la chaleur
Viscosité, Brookfield, @ 25.0 °C Speed 5 rpm 10900.0 mPa.s (cP)