LOCTITE® ECCOBOND NCP 5209

Features and Benefits

A yellow non-conductive die-attach adhesive for thermal compression bonding processes in flip-chip to laminate assembly.
LOCTITE® ECCOBOND NCP 5209 is a pale yellow, acrylate-based, non-conductive die-attach adhesive for advanced flip-chip Cu pillar applications. It leverages thermal compression bonding for robust bump protection. It is compatible with small assembly gaps and tight pitches and is typically used as a pre-applied underfill to provide optimal fluxing activity for good solder joint formation. It cures fast when exposed to heat.
  • High purity
  • Non-conductive
  • Excellent protection of electrical joints
  • Compatible with small assembly gap and tight pitches
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Technical Information

Coefficient of thermal expansion (CTE), Above Tg 80.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 28.0 ppm/°C
Extractable ionic content, Chloride (CI-) 10.0 ppm
Extractable ionic content, Potassium (K+) 10.0 ppm
Extractable ionic content, Sodium (Na+) 10.0 ppm
Glass transition temperature (Tg) 145.0 °C
Storage modulus, DMA @ 25.0 °C 7.3 GPa (7300.0 N/mm² , 1058775.0 psi )
Storage temperature -40.0 °C
Viscosity, @ 25.0 °C Spindle 51, speed 5 rpm 12500.0 mPa·s (cP)