LOCTITE® ECCOBOND NCP 5209
Features and Benefits
A yellow non-conductive die-attach adhesive for thermal compression bonding processes in flip-chip to laminate assembly.
LOCTITE® ECCOBOND NCP 5209 is a pale yellow, acrylate-based, non-conductive die-attach adhesive for advanced flip-chip Cu pillar applications. It leverages thermal compression bonding for robust bump protection. It is compatible with small assembly gaps and tight pitches and is typically used as a pre-applied underfill to provide optimal fluxing activity for good solder joint formation. It cures fast when exposed to heat.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 80.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 28.0 ppm/°C |
| Extractable ionic content, Chloride (CI-) | 10.0 ppm |
| Extractable ionic content, Potassium (K+) | 10.0 ppm |
| Extractable ionic content, Sodium (Na+) | 10.0 ppm |
| Glass transition temperature (Tg) | 145.0 °C |
| Storage modulus, DMA @ 25.0 °C | 7.3 GPa (7300.0 N/mm² , 1058775.0 psi ) |
| Storage temperature | -40.0 °C |
| Viscosity, @ 25.0 °C Spindle 51, speed 5 rpm | 12500.0 mPa·s (cP) |
LOCTITE® ECCOBOND NCP 5209
A yellow non-conductive die-attach adhesive for thermal compression bonding processes in flip-chip to laminate assembly.