LOCTITE® ABLESTIK NCA 2280
功能與優點
This high viscosity, thixotropic electrically non-conductive adhesive is specially designed for use in the assembly of temperature sensitive electronic components. It has a dual cure to allow for adjustments.
LOCTITE® ABLESTIK NCA 2280 is specially designed for use in the assembly of temperature sensitive electronic components, and has been formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. Temporarily curing the material gives you the freedom to make any necessary adjustments to the final device configuration (the product’s high viscosity and thixotropy also help). It is black in color to prevent light penetration into the final assembled device.
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技術資訊
| 儲存溫度 | -20.0 °C |
| 剪切強度 | 2900.0 psi |
| 固化類型 | 熱固化 |
| 建議固化方式, 推薦的： | 2.0 秒 |
| 建議固化方式光強度 | 100.0 mW/cm² |
| 建議推廣應用 | 陶瓷 |
| 粘度，錐型和板型, Cone 20 mm, Angle 2° @ 25.0 °C Shear Rate 10 s⁻¹ | 54000.0 mPa.s (cP) |
| 觸變指數 | 4.4 |
| 零組件數 | 1 組分 |
LOCTITE® ABLESTIK NCA 2280
This high viscosity, thixotropic electrically non-conductive adhesive is specially designed for use in the assembly of temperature sensitive electronic components. It has a dual cure to allow for adjustments.