LOCTITE® ABLESTIK NCA 2280
Características e Benefícios
This high viscosity, thixotropic electrically non-conductive adhesive is specially designed for use in the assembly of temperature sensitive electronic components. It has a dual cure to allow for adjustments.
LOCTITE® ABLESTIK NCA 2280 is specially designed for use in the assembly of temperature sensitive electronic components, and has been formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. Temporarily curing the material gives you the freedom to make any necessary adjustments to the final device configuration (the product’s high viscosity and thixotropy also help). It is black in color to prevent light penetration into the final assembled device.
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Informação Técnica
| Cronograma de cura, Recomendado | 2.0 seg. |
| Força de cisalhamento | 2900.0 psi |
| Intensidade de luz do programa de cura | 100.0 mW/cm² |
| Número de componentes | Monocomponente |
| Recomendado para uso com | Cerâmica |
| Temperatura de armazenamento | -20.0 °C |
| Tipo de cura | Cura por Calor |
| Viscosidade, cone & placa, Cone 20 mm, Angle 2° @ 25.0 °C Shear Rate 10 s⁻¹ | 54000.0 mPa.s (cP) |
| Índice tixotrópico | 4.4 |
LOCTITE® ABLESTIK NCA 2280
This high viscosity, thixotropic electrically non-conductive adhesive is specially designed for use in the assembly of temperature sensitive electronic components. It has a dual cure to allow for adjustments.