LOCTITE® ABLESTIK NCA 2280
Caractéristiques et avantages
This high viscosity, thixotropic electrically non-conductive adhesive is specially designed for use in the assembly of temperature sensitive electronic components. It has a dual cure to allow for adjustments.
LOCTITE® ABLESTIK NCA 2280 is specially designed for use in the assembly of temperature sensitive electronic components, and has been formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. Temporarily curing the material gives you the freedom to make any necessary adjustments to the final device configuration (the product’s high viscosity and thixotropy also help). It is black in color to prevent light penetration into the final assembled device.
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Informations techniques
| Indice thixotropique | 4.4 |
| Intensité légère programme de durcissement | 100.0 mW/cm² |
| Nombre de composants | Mono composant |
| Programme de durcissement, Recommandé | 2.0 sec. |
| Recommandé pour une utilisation avec | Céramique |
| Résistance au cisaillement | 2900.0 psi |
| Température de stockage | -20.0 °C |
| Type de polymérisation | Polymérisation par la chaleur |
| Viscosité, Cône & Plan, Cone 20 mm, Angle 2° @ 25.0 °C Shear Rate 10 s⁻¹ | 54000.0 mPa.s (cP) |
LOCTITE® ABLESTIK NCA 2280
This high viscosity, thixotropic electrically non-conductive adhesive is specially designed for use in the assembly of temperature sensitive electronic components. It has a dual cure to allow for adjustments.