LOCTITE® ABLESTIK NCA 2280
Features and Benefits
This high viscosity, thixotropic electrically non-conductive adhesive is specially designed for use in the assembly of temperature sensitive electronic components. It has a dual cure to allow for adjustments.
LOCTITE® ABLESTIK NCA 2280 is specially designed for use in the assembly of temperature sensitive electronic components, and has been formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. Temporarily curing the material gives you the freedom to make any necessary adjustments to the final device configuration (the product’s high viscosity and thixotropy also help). It is black in color to prevent light penetration into the final assembled device.
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Technical Information
| Cure schedule light intensity | 100.0 mW/cm² |
| Cure schedule, Recommended | 2.0 sec. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Recommended for use with | Ceramic |
| Shear strength | 2900.0 psi |
| Storage temperature | -20.0 °C |
| Thixotropic index | 4.4 |
| Viscosity, cone & plate, Cone 20 mm, Angle 2° @ 25.0 °C Shear Rate 10 s⁻¹ | 54000.0 mPa·s (cP) |
LOCTITE® ABLESTIK NCA 2280
This high viscosity, thixotropic electrically non-conductive adhesive is specially designed for use in the assembly of temperature sensitive electronic components. It has a dual cure to allow for adjustments.