LOCTITE® 3611
功能與優點
LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive
LOCTITE® 3611 is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines. The very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.
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技術資訊
| 儲存溫度 | 2.0 - 8.0 °C |
| 剪切強度, 鋼（噴砂） | 2175.0 psi |
| 卡森粘度，錐型和板型，Haake PK100、M10/PK1，2° | 20.0 - 50.0 Pa∙s |
| 固化類型 | 熱固化 |
| 建議固化方式, @ 150.0 °C | 90.0 - 120.0 秒 |
| 物理形態 | 凝膠 |
| 零組件數 | 1 組分 |
LOCTITE® 3611
LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive