LOCTITE® 3611
特長および利点
LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive
LOCTITE® 3611 is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines. The very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.
詳細はこちら
技術情報
| Casson粘度、コーン＆プレート Haake PK100, M10/PK1, 2° | 20.0 - 50.0 パスカル秒 |
| せん断強度, 鋼（グリットブラスト） | 2175.0 psi |
| 保存温度 | 2.0 - 8.0 °C |
| 外観 | ゲル |
| 形態 | 1液 |
| 硬化スケジュール, @ 150.0 °C | 90.0 - 120.0 秒 |
| 硬化タイプ | 熱硬化 |
LOCTITE® 3611
LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive