LOCTITE® 3611
Características y Ventajas
LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive
LOCTITE® 3611 is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines. The very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.
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Información técnica
| Casson viscosidad, cono & placa Haake PK100, M10/PK1, 2° | 20.0 - 50.0 Pa∙s |
| Forma física | Gel |
| Número de componentes | Monocomponente |
| Programa de curado, @ 150.0 °C | 90.0 - 120.0 s |
| Resistencia al corte, Acero (granallado) | 2175.0 psi |
| Temperatura de almacenaje | 2.0 - 8.0 °C |
| Tipo de curado | Curado Térmico |
LOCTITE® 3611
LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive