LOCTITE® 3611
Features and Benefits
LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive
LOCTITE® 3611 is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines. The very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.
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Documents and Downloads
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Technical Information
| Casson viscosity, cone & plate Haake PK100, M10/PK1, 2° | 20.0 - 50.0 Pa∙s |
| Cure schedule, @ 150.0 °C | 90.0 - 120.0 sec. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Physical form | Gel |
| Shear strength, Steel (grit blasted) | 2175.0 psi |
| Storage temperature | 2.0 - 8.0 °C |
LOCTITE® 3611
LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive