LOCTITE® ABLESTIK ICP 3920

功能與優點

This 1-part, low-temperature curing, electrically conductive die-attach adhesive is designed for SMD interconnect formation and stencil/screen printing.
LOCTITE® ABLESTIK ICP 3920 is a silver, electrically conductive die-attach adhesive for dispense or printing applications and surface-mount technology (SMT) assembly processes. It’s a low-viscosity, low-CTE and Pb-free alternative to solder with a long work life for minimal product waste and clean-up time. It’s formulated with an epoxy-based resin, cures fast when exposed to heat and doesn’t require any post-cure. LOCTITE ABLESTIK ICP 3920 is an improved version of ABLESTIK CE 3920 and can be used with finer dispensing needles without clogging.
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技術資訊

使用方法 點膠槍
儲存溫度 0.0 - 8.0 °C
剪切強度 1310.0 psi
固化類型 熱固化
建議固化方式, @ 110.0 °C 60.0 分
操作溫度 -45.0 - 150.0 °C
粘度,錐型和板型, Angle 3° Speed 5 rpm 26100.0 mPa.s (cP)
觸變指數 5.7
零組件數 2 組分
體積電阻率 0.0003 Ohm cm