LOCTITE® ABLESTIK ICP 3920
Características e Benefícios
This 1-part, low-temperature curing, electrically conductive die-attach adhesive is designed for SMD interconnect formation and stencil/screen printing.
LOCTITE® ABLESTIK ICP 3920 is a silver, electrically conductive die-attach adhesive for dispense or printing applications and surface-mount technology (SMT) assembly processes. It’s a low-viscosity, low-CTE and Pb-free alternative to solder with a long work life for minimal product waste and clean-up time. It’s formulated with an epoxy-based resin, cures fast when exposed to heat and doesn’t require any post-cure. LOCTITE ABLESTIK ICP 3920 is an improved version of ABLESTIK CE 3920 and can be used with finer dispensing needles without clogging.
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Informação Técnica
| Cronograma de cura, @ 110.0 °C | 60.0 min. |
| Força de cisalhamento | 1310.0 psi |
| Método de aplicação | Pistola Dosadora |
| Número de componentes | Bicomponente |
| Resistividade volumétrica | 0.0003 Ohm cm |
| Temperatura de armazenamento | 0.0 - 8.0 °C |
| Temperatura de operação | -45.0 - 150.0 °C |
| Tipo de cura | Cura por Calor |
| Viscosidade, cone & placa, Angle 3° Speed 5 rpm | 26100.0 mPa.s (cP) |
| Índice tixotrópico | 5.7 |
LOCTITE® ABLESTIK ICP 3920
This 1-part, low-temperature curing, electrically conductive die-attach adhesive is designed for SMD interconnect formation and stencil/screen printing.