LOCTITE® ABLESTIK ICP 3920
Features and Benefits
This 1-part, low-temperature curing, electrically conductive die-attach adhesive is designed for SMD interconnect formation and stencil/screen printing.
LOCTITE® ABLESTIK ICP 3920 is a silver, electrically conductive die-attach adhesive for dispense or printing applications and surface-mount technology (SMT) assembly processes. It’s a low-viscosity, low-CTE and Pb-free alternative to solder with a long work life for minimal product waste and clean-up time. It’s formulated with an epoxy-based resin, cures fast when exposed to heat and doesn’t require any post-cure. LOCTITE ABLESTIK ICP 3920 is an improved version of ABLESTIK CE 3920 and can be used with finer dispensing needles without clogging.
- Pb-free
- Offers a long work life
- No post-cure required
- Thermosetting
- Low viscosity and low CTE
Documents and Downloads
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Technical Information
| Application method | Dispense gun |
| Cure schedule, @ 110.0 °C | 60.0 min. |
| Cure type | Heat cure |
| Number of components | 2 part |
| Operating temperature | -45.0 - 150.0 °C |
| Shear strength | 1310.0 psi |
| Storage temperature | 0.0 - 8.0 °C |
| Thixotropic index | 5.7 |
| Viscosity, cone & plate, Angle 3° Speed 5 rpm | 26100.0 mPa·s (cP) |
| Volume resistivity | 0.0003 Ohm cm |
LOCTITE® ABLESTIK ICP 3920
This 1-part, low-temperature curing, electrically conductive die-attach adhesive is designed for SMD interconnect formation and stencil/screen printing.