LOCTITE® ABLESTIK ICP 3920

Features and Benefits

A silver electrically conductive die-attach adhesive for SMD interconnect formation and stencil/screen printing.
LOCTITE® ABLESTIK ICP 3920 is a 1-part, silver, electrically conductive die-attach adhesive for dispense or printing applications and surface-mount technology (SMT) assembly processes. It exhibits a long work life for minimal product waste and clean-up time. It is a low-viscosity, low-CTE and Pb-free alternative to solder that cures fast when exposed to heat and doesn’t require any post-cure. LOCTITE ABLESTIK ICP 3920 is an improved version of LOCTITE® ABLESTIK CE 3920 and can be used with finer dispensing needles without clogging.
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Technical Information

Application method Dispense gun
Cure schedule, @ 110.0 °C 60.0 min.
Cure type Heat cure
Number of components 2 part
Operating temperature -45.0 - 150.0 °C
Shear strength 1310.0 psi
Storage temperature 0.0 - 8.0 °C
Thixotropic index 5.7
Viscosity, cone & plate, Angle 3° Speed 5 rpm 26100.0 mPa·s (cP)
Volume resistivity 0.0003 Ohm cm