LOCTITE® ABLESTIK 8700K
功能与优点
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
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技术信息
| RT 模剪切强度, 2 x 2 mm on Gold | 5000.0 kg-f |
| 体积电阻率 | 3x10¹⁴ Ohm cm |
| 固化方式 | 热+紫外线 |
| 固化时间, @ 175.0 °C | 1.0 小时 |
| 导热性 | 0.5 W/mK |
| 应用 | 芯片焊接 |
| 热膨胀系数 (CTE) | 20.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 55.0 ppm/°C |
| 玻璃化温度 (Tg) | 165.0 °C |
| 粘度, @ 25.0 °C | 45000.0 mPa.s (cP) |
| 颜色 | 白 |
LOCTITE® ABLESTIK 8700K
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.