LOCTITE® ABLESTIK 8700K
Lastnosti in prednosti
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
Preberite več
Dokumenti in prenosi
Ali iščete tehnični list ali varnostni list v drugem jeziku?
Tehnične informacije
Barva | Bela |
Koeficient toplotnega raztezanja (CTE) | 20.0 ppm/°C |
Koeficient toplotnega raztezanja (CTE), Above Tg | 55.0 ppm/°C |
Način strjevanja | Strjevanje na podlagi toplote |
Primeri uporabe | Pritrjevalniki |
Prostorninska upornost | 3x10¹⁴ Ohm cm |
Strižna trdnost RT, 2 x 2 mm on Gold | 5000.0 kg-f |
Temperatura posteklenitve (Tg) | 165.0 °C |
Toplotna prevodnost | 0.5 W/mK |
Urnik strjevanja, @ 175.0 °C | 1.0 ure |
Viskoznost, @ 25.0 °C | 45000.0 mPa.s (cP) |